On the Distinction between Instrumented Indentation Technique and X-ray Diffraction Method in Nondestructive or Semi-Nondestructive Surface Stress Measurement
نویسندگان
چکیده
منابع مشابه
Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages1
Transmission X-ray diffraction imaging in both monochromatic and white beam section mode has been used to measure quantitatively the displacement and warpage stress in encapsulated silicon devices. The displacement dependence with position on the die was found to agree well with that predicted from a simple model of warpage stress. For uQFN microcontrollers, glued only at the corners, the measu...
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ژورنال
عنوان ژورنال: Journal of the Society of Materials Science, Japan
سال: 2016
ISSN: 0514-5163,1880-7488
DOI: 10.2472/jsms.65.319